| ［Features］ | |
| ● | High density plasma creation. |
| ● | High dissociation of gas species. |
| ● | Low damage by ion bombardment due to low ion energy. |
| ● | Independent energy distribution from applied RF power. |
| ● | High SP3 Content DLC source. |
| ［Application］ | |
| ● | PECVD with high deposition rate for nc-Si, μc-Si, SiO2, ZnO, Al2O3. |
| ● | Surface activation prior to Organic EL film deposition. |
| ● | Low damage etching. |
| ● | Protective DLC film with high SP3 Content. |
| ● | Low friction and durable layer formation for lubrication. |
|
Characteristics of COPRA Source
Ion Energy vs. RF-Power
Ion Current Density vs. RF-Power
Ion Energy Distribution
|
COPRA DN250 GT
COPRA DN400
COPRA LS9